Fundamentals of Lead-Free Solder Interconnect Technology
From Microstructures to Reliability
(Sprache: Englisch)
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys....
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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.Inhaltsverzeichnis zu „Fundamentals of Lead-Free Solder Interconnect Technology “
Introduction.- Interconnection : The Joint.- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys.- Microstructure Development; Solidification and Isothermal Aging.- Thermal Cycling Performance.- Mechanical Stability and Performance.- Chemical and Environment Attack.- Challenges in Future Generation Interconnects: Microstructure Again.Bibliographische Angaben
- Autoren: Tae-Kyu Lee , Thomas R. Bieler , Choong-Un Kim , Hongtao Ma
- 2016, Softcover reprint of the original 1st ed. 2015, XIII, 253 Seiten, 81 farbige Abbildungen, Masse: 15,9 x 23,6 cm, Kartoniert (TB), Englisch
- Verlag: Springer, Berlin
- ISBN-10: 1489978011
- ISBN-13: 9781489978011
Sprache:
Englisch
Pressezitat
From the book reviews:"The book gives wide perspectives on the technical insights of lead-free solder interconnect system and reliability prediction in industry while adding very valuable industry insights. It is a good resource to demonstrate the many facets of lead-free solder interconnection, and can serve as a very informative technical reference. Valuable as a learning tool for fundamentals of lead-free solder interconnect technology, its clear relevance to real world industry practices make it useful for both academics and semiconductor industry practitioners." (Chong Leong Gan and Uda Hashim, Microelectronics Reliability, February, 2015)
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