Reliability of Microtechnology
Interconnects, Devices and Systems
(Sprache: Englisch)
This text discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. It covers many topics, and it addresses specific failure modes in solder and conductive adhesives at great length.
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This text discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. It covers many topics, and it addresses specific failure modes in solder and conductive adhesives at great length.
Klappentext zu „Reliability of Microtechnology “
Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.The book also includes exercises and detailed solutions at the end of each chapter.
Inhaltsverzeichnis zu „Reliability of Microtechnology “
- Introduction to Reliability and its Importance- Reliability Metrology
- General Failure Mechanisms of Microsystems
- Solder and Conductive Adhesive Joint Reliability
- Accelerated Testing
- Reliability Design for Manufacturability
- Component Reliability
- System Level Reliability
- Reliability and Quality Management of Microsystem
- Experimental Tools for Reliability Analysis
Bibliographische Angaben
- Autoren: Johan Liu , Olli Salmela , Jussi Sarkka , James E. Morris , Per-Erik Tegehall , Cristina Andersson
- 2011, 2011, XIII, 204 Seiten, Masse: 17,2 x 23,6 cm, Kartoniert (TB), Englisch
- Verlag: Springer, Berlin
- ISBN-10: 1489982116
- ISBN-13: 9781489982117
Sprache:
Englisch
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