1
/
von
1
Thermal Management Materials for Electronic Packaging (Xingyou Tian)
Thermal Management Materials for Electronic Packaging (Xingyou Tian)
Normaler Preis
CHF 155.60
Normaler Preis
Verkaufspreis
CHF 155.60
Inkl. MwSt.
Versand wird bei Kasse berechnet
Sofort ab Lager lieferbar.
Anzahl
Verfügbarkeit für Abholungen konnte nicht geladen werden
Summarizes the development of thermal management materials and introduces the preparation methods and application scenarios of thermal management materials for electronic packing.
Autorenportrait
Professor Xingyou Tian is Deputy Director of Institute for Solid State Physics (ISSP), Hefei Institutes of Physical Science, Chinese Academy of Sciences and Director of the Key Laboratory of Photovoltaic and Energy-Saving Materials of the Chinese Academy of Sciences. His main research include key functional materials for electronic devices, integrated circuit heat dissipation materials, polymer nanocomposite materials, and new energy-saving and environmentally friendly materials.
Weitere Angaben
Buch (Hardcover), Englisch, 368 Seiten

Jetzt Liquidations-News abonnieren
Immer die neusten Abverkäufe und Räumungen kennen! (Max. 1 Nachricht / Monat)